Free Download Force Sensors for Microelectronic Packaging Applications by Jürg Schwizer, Michael Mayer, Oliver Brand
English | 2005 | ISBN: 3540221875 | 178 Pages | PDF | 16.8 MB
Intended for wire-bonding and flip-chip packaging professionals and for scientists and engineers working in the field of mechanical microsensors, this practical monograph introduces novel measurement technologies that allow for in situ and real-time examination of physical processes during the packaging process or during subsequent reliability tests.